Cold plates, heat pipe & vapor chamber modules, CDU units — from heat sinks to complete system thermal solutions.
Sevinol's thermal management line covers both liquid cooling and air cooling, delivering complete thermal components from cold plates and heat sink modules to CDU coolant distribution units for high power-density applications, from prototype validation to volume manufacturing.
Core products: liquid cold plates (embedded copper tube, vacuum brazing, friction stir welding FSW, electron-beam diffusion bonding), heat pipe and vapor chamber (VC) modules (standard heat pipe, composite heat pipe, VC, 3DVC, roll-bond plate, base phase-change), CDU coolant distribution units (rack / drawer / integrated) and quick couplings and tubing. Widely used in IDC data centers, semiconductor equipment, medical CT, EV and power electronics.
Select by heat-source power density, mounting space and coolant. Thermal resistance, flow resistance, flatness and pressure ratings are customized per project — contact us for the specification sheet.
| Application | Recommended Product |
|---|---|
| Server CPU / GPU cooling | Cold plate (vacuum brazing / embedded tube) |
| AI compute modules | Cold plate + quick coupling |
| Inverter / power electronics | Inverter thermal module |
| Medical CT / X-ray tube | CT water-cooled plate · copper manifold |
| Rack-level liquid cooling | CDU (rack / drawer type) |
| Space-constrained air cooling | VC vapor chamber · composite heat pipe |
| High-power laser / radar | Jet-impingement cold plate (>500 W/cm²) |
Cold plates, heat sink modules, CDU and quick couplings; other specifications on request.
Embedded copper tube / vacuum brazing / FSW / e-beam diffusion bonding. For servers, AI compute modules and high-power devices.
Standard heat pipe, composite heat pipe, VC vapor chamber, 3DVC and roll-bond heat sinks for space-constrained air cooling.
Rack / drawer / integrated coolant distribution units with MODBUS TCP / RTU communication for rack-level liquid cooling.
Quick couplings and tubing assemblies for liquid cooling systems, with PTFE corrugated, EPDM, copper and stainless options.
Beyond standard products we offer OEM/ODM thermal design and manufacturing: cold plates and heat sink modules tailored to your heat load, mounting space and system flow resistance — from requirements and thermal simulation to prototype, reliability validation and volume production.
Send your thermal requirements (heat load, size limits, coolant) to Contact for a feasibility assessment and quotation.
